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Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
TC1-200G | |
|---|---|
DigiKey Part Number | TC1-200G-ND |
Manufacturer | |
Manufacturer Product Number | TC1-200G |
Description | HEAT SINK COMPOUND - HIGH DENSIT |
Manufacturer Standard Lead Time | 4 Weeks |
Customer Reference | |
Detailed Description | Thermal Silicone Compound 200 gram Jar |
Datasheet | Datasheet |
Product Attributes
Type | Description | Select All |
|---|---|---|
Category | ||
Manufacturer | Chip Quik Inc. | |
Series | - | |
Packaging | Bulk | |
Part Status | Active | |
Type | Silicone Compound | |
Size / Dimension | 200 gram Jar | |
Usable Temperature Range | - | |
Color | White | |
Thermal Conductivity | 0.67W/m-K | |
Features | - | |
Shelf Life | 60 Months | |
Storage/Refrigeration Temperature | 37°F ~ 77°F (3°C ~ 25°C) | |
Material Flammability Rating | - | |
Shelf Life Start | Date of Manufacture | |
Shipping Info | Shipped from DigiKey | |
Digi-Key Storage | - |
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Quantity
All prices are in USD
Bulk
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 1 | $49.95000 | $49.95 |
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